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Research update

Imec demonstrates critical building blocks for a backside power delivery network

Summary

In several papers presented at the 2021 Symposia on VLSI Technology and Circuits (VLSI 2021), imec reports progress in developing enabling technologies for a backside power delivery network. 

First, the impact of backside wafer processing on the performance of ‘frontside’ FinFET devices was investigated. 

Second, the team revealed new approaches for efficient power delivery and conversion that are compatible with backside processing. 

And finally, the impact of backside connection on I/O performance is discussed from a system-technology co-optimization (STCO) perspective.