3D at imec
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A view on the 3D technology landscape

Design and technology options for 3D systems-on-chip


In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. 

In this interview, Eric Beyne, Senior Fellow, VP R&D and Program Director 3D System Integration at imec, reviews the trends and discusses the technologies that are needed for building the next-generation 3D systems-on-chip. 

The progress reported at all levels will take system design and development into the next level, promising big rewards in the system’s power-performance-area-cost (PPAC) metrics.