PR D2W hybrid bonding
/Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Press release

Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Improved die-to-wafer assembly flow opens doors to logic/memory-on-logic stacking, and to optically interconnected systems-on-wafer

About imec

Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2023, imec's revenue (P&L) totaled 941 million euro.

Further information on imec can be found at www.imec-int.com.

Imec is a registered trademark for the activities of imec International (IMEC International, a legal entity set up under Belgian law as a “stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland supported by the Dutch Government),  imec Taiwan (IMEC Taiwan Co.), imec India (IMEC India Private Limited), imec San Francisco (IMEC Inc.) and imec Florida (IMEC USA Nanoelectronics Design Center Inc.).