Connect technology centers
/Expertise/CMOS: advanced and beyond/Connect technology centers

Connect technology centers

Learn more about the various connectivity options explored by imec.

One way to keep increasing the performance of technology is to remove bottlenecks by optimizing various connection technologies. Imec’s research explores enablers for 3D integration through die-to-wafer or wafer-to-wafer bonding, optical I/O technologies, and advanced RF based on the use of compound semiconductors from a system perspective.

Click on the topics below to learn more.

3D integration
3D integration

Imec explores different paths for the three-dimensional stacking of ICs.

Click for more

Optical interconnects
Optical interconnects

The need for I/O bandwidth can only be met by further improving optical links.

Click for more