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Connect technology centers

Learn more about the various connectivity options explored by imec.

One way to keep increasing the performance of technology is to remove bottlenecks by optimizing various connection technologies. Imec’s research explores enablers for 3D integration through die-to-wafer or wafer-to-wafer bonding, optical I/O technologies, and advanced RF based on the use of compound semiconductors from a system perspective.

Click on the topics below to learn more.

3D integration
3D integration
Optical interconnects
Optical interconnects

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