Recently, a new standard for die-level design-for-test (DfT) features in 3D integrated circuits (3D ICs) was published by IEEE Standards Association. The standard, called IEEE Std 1838™-2019, describes how to build a test access architecture that makes it possible to test individual dies once they are stacked to form a 3D IC. In other words, it allows stacked dies in 3D ICs to cooperate such that all of them can connect with external test equipment. The standard is available through the IEEE Xplore Digital Library.
In the online media resource 3D InCites, Erik Jan Marinissen, scientific director at imec and founder and first chair of the IEEE standardization working group on 3D-DfT, talks about the standardization effort, and discusses the standard itself and its importance for the 3D-IC community.
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