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Introducing 2D materials in the logic technology roadmap: five good reasons, three major challenges


2D materials such as tungsten disulfide (WS2) can play a crucial role in the fabrication of future logic chips. Due to their exceptional properties, they promise to enable ultimate gate length scaling, and can therefore extend the logic transistor scaling roadmap. They could also revolutionize how we think about chip architecture, blurring the line between front-end and back-end by enabling compact back-end-compatible transistors.

In recent years, lab-based 2D-transistors have matured considerably, and a route is being developed for their industrial uptake. In parallel, remaining challenges towards improved device performance are being addressed.

Below, Iuliana Radu, program director at imec, explains the worldwide interest in these materials, especially their promise to further extend the logic technology roadmap.