IC prototyping
One of the biggest hurdles innovators must take is transforming an idea or proof of concept for a chip into a working prototype.
A key consideration is manufacturability, the creation of a reliable fabrication process that remains valid all the way up to hardware validation or high-volume manufacturing. That results in lower total development costs and a faster time to market.
Especially when the device requires advanced or emerging process modules, the big commercial foundries are reluctant to take on such a prototyping project. And university labs lack the necessary commercial-grade equipment and product development methodology.
One point of access for a full prototyping workflow
As the world’s leading micro- and nanotechnology R&D hub that bridges academia and industry, imec uniquely has the processing capabilities and supporting expertise to take on such product-enabling projects.
Our multi-project wafer (MPW) service through our ASIC development division imec.IC-link allows you to share costs with other companies to cost-effectively manufacture a handful of prototypes – in commercially established technologies, but also in imec’s own advanced technology platforms such as GaN and integrated photonics.
Additionally, we act as a flex fab for established companies and start-ups who want to work out a custom flow for their groundbreaking device for a wide range of applications. Our support can include all steps of the development process, from design support up to packaging and qualification.
Central to our capabilities is a 130nm CMOS baseline in our 200mm research fab, and a 65/28nm baseline in our 300mm research fab, both with a complete PDK.
Our specialty toolbox of design capabilities and process modules includes:
- specialty pixels for imaging in SWIR, UV, etc.
- silicon and silicon nitride photonics
- nano-optics, such as on-chip spectral filters, NIL masters, flat optics and processing on glass to produce complex optical devices
- M(O)EMS, fluidics and nanomachining
- 3D integration through hybrid bonding, through silicon via (TSV), heterogenous integration, etc.
- novel materials: magnetic, electro-optic, platinum, etc.
- GaN-on-Si for 200V and 650V (e-mode) power devices
- CMOS post-processing
Supporting expertise for dedicated applications
To tailor imec’s technology toolbox to your application, imec’s experts bring in a wealth of expert knowledge to support your prototyping project. This includes:
- imaging, sensing and actuation
- optical beamforming
- silicon and silicon nitride photonics design, including customized laser design for integration with silicon photonics
- nano-imprint lithography
Want to talk about your prototyping needs? Click the button below to get in touch.
