Imec has an excellent track record of providing industry-relevant solutions for next-generation logic and memory devices. Our R&D offering is supported by our world-famous expertise in characterization, metrology, design, modeling, reliability analysis, system-technology co-optimization and more.
From exploratory research to development and/or production, we deliver product-relevant funneling and concrete solutions through a unique and valuable ecosystem of industry, suppliers and academic players.
Industry’s largest partner ecosystem
Imec brings together all key players from all layers of the value chain of the semiconductor industry, from tool & material suppliers to IDMs & foundries and fabless & fablite companies all the way up to the application partners.
More than ever, equipment & material suppliers are playing a key role in collectively tackling the scaling challenges posed by today’s fast-evolving, equipment-intensive, consolidating semiconductor landscape. Strong R&D interactions between manufacturers and suppliers at an early stage of development help to accelerate technology advancements, enabling efficient cost sharing, minimizing risk, and optimizing the return on investment for IDMs & foundries as well as equipment suppliers.
Industry’s most advanced R&D 300mm cleanroom facility
Imec offers a neutral, open innovation R&D platform that involves suppliers more deeply and at an early stage of process step and module development. Thanks to our close partnerships with leading tool and materials suppliers, we can do advanced process development and offer our partners the industry’s most advanced research infrastructure housed within a state-of-the-art 300mm cleanroom.
Our advanced semiconductor technology and processing R&D covers diverse topics including:
Next-generation logic devices
Explore why imec’s research and R&D into logic device scaling makes it the ideal partner in realizing advanced logic devices projects.
Novel memory concepts
Find out more about imec’s world-leading research into low-temperature and powerful storage solutions for next-generation devices.
Advanced patterning and key process steps
Learn more about imec’s best-in-class infrastructure for the development of front and back end-of-line processes and patterning technologies.
3D system integration
Learn more about imec’s pioneering R&D activities concerning advanced 3D interconnect technology.
Discover more about imec’s R&D and industrial affiliation program addressing advanced interconnects.
Explore imec’s expertise and R&D activities in neuromorphic computing aiming to surpass the possibilities of silicon CMOS.
Learn more about imec’s advanced research into quantum computing, supercomputing and scaling CMOS beyond 5nm technology.
Leveraging imec’s broad expertise in a variety of technologies, we develop RF front-end technologies for mobile handsets that meet the requirements of 5G. Together with our program partners, we explore hybrid III-V/Si technology to take RF beyond the speed and power limits of CMOS technologies.
Materials and Components Analysis
To keep up with Moore’s law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials. This in turn pushes the need for new solid-state analytical capabilities, whether for materials characterization or inline metrology.
How can we help you?
Some examples of what we have done
At imec bright people build a bright future.
You could be one of these builders. Whether you are an engineer or an operator, a consultant or PhD student, we need a versatile group of people to help us create positive change.Join the forward thinkers
Characterization and Modeling of Ferro and AntiFerro Device
Explore the potential of Ferro and Antiferro devices and materials in post-Moore's systems and circuits
Alternative solder materials for electronic devices working at low/cryogenic temperatures
Which solder will work for the packaging of quantum computers? The goal of this PhD thesis is to select and study the metals that can be used as solder and UBM for packaging and 3D integration of devices for low temperature applications particularly quantum computers.
New Frontiers in Wired, Optical and Wireless Communications
You will be architecting the wired, optical and wireless networks of tomorrow!
Circuit and System Level Exploration of Sequential 3D Technology
Identifying the possibility of imec sequential 3D technology in post-Moore era.More job opportunities
What can we do for you?
- Our industrial affiliation program connects you to our global partner ecosystem and gives you access to shared research results.
- Our industrial affiliation programs enable you to share costs and lower the risk of precompetitive research through collaboration.
- Our research teams closely collaborate with yours to accelerate your product roadmap and shorten your time-to-market.
Why work with us?
- Our unique, state-of-the-art 300mm infrastructure is the most advanced research facility in the world.
- Our in-depth technology knowledge is supported by our impressive expertise centers in material and component analysis, modeling, metrology, reliability, process steps, system-technology co-optimization, and more.